Riston yieldmaster wet lamination technology.
Polyimide tape laminator.
Low charging polyimide film 2 4 mils thick with polysiloxide adhesive wescorp tape generates less 50 volts when unwound from roll at 73 f 45 rh average making it safe to use around most esd sensitive items.
Dunmore is one of the leading polyimide tape converters in the world specializing in polyimide tape for spacecraft aircraft and electronic applications.
Mcmaster carr is the complete source for your plant with over 595 000 products.
Specifications of polyimide film tapes include 013 mm to 127 mm backing thickness 025 mm to 089 mm adhesive thickness 064 mm to 165 mm total thickness 15 oz in.
Yieldmaster technology is a dupont unique technology to deliver optimum yields through the use of a specially developed thin resist lamination system and the proven six sigma approach to defect reduction and equipment design.
81270 tape wescorp esd polyimide hi temp 1 4 in x 36 yds.
Tested per ansi esd s11 11.
Established in 1978 tuff industries is a leading custom manufacturer of adhesive tape solutions for various industries and applications.
Wescorp antistatic polymide tape high temp.
Combining our state of the art manufacturing technologies with our unparalleled commitment to customer service tuff industries forms deep decade long partnerships with customers to provide high quality.
98 of products ordered ship from stock and deliver same or next day.
Dupont adhesiveless all polyimide copper clad flexible laminates ccl using high performance kapton composite dielectrics are available in a wide variety of copper types thicknesses and construction options.
1 4 in x 36 yds 3 in plastic core.
It does not melt when fused with other thermoplastic materials commonly used in catheter manufacturing.
Tensile strength 25 percent to 75 percent elongation and minus 100 degrees to plus 500 degrees operating temperature.
Adhesion strength 10 lbs in.
Polyimide tape dunmore offers metalizing laminating and coating services to convert polyimide film into polyimide tape.