Polymer Ceramic Composites For Microwave Applications

Interestingly the incorporation of polystyrene ps by the coating route could significantly improve the thermal behaviors of the composites hdpe ps bnt besides the temperature.

Polymer ceramic composites for microwave applications.

Ptfe based composites involving ceramics with high. In the previous works about high dielectric constant ptfe composites the ba mg 1 3 ta 2 3 o 3 ba 4 2 nd 9 2 ti 18 o 54 teo 2 li 2 mg 3 tio 6 na 0 6 li 0 4 0 5 nd 0 5 tio 3 li 2 tio 3 ceramic powders had been added into the ptfe matrix to fabricate composites for microwave substrate applications 19 20. Polymer ceramic composites for microwave applications. Ceramic filled polymer composites are finding increasing applications in electronic and microwave devices since they combine ceramic s electrical properties and the mechanical flexibility chemical stability and processing possibility of polymers polymer ceramic composites with low relative dielectric constant ɛ r 10 and high quality factor q on one hand are.

Polymer ceramic composites have also been investigat ed 14 16 recently chen et al 17 reported the microwave dielectric properties of ptfe sio 2 composite and due to its low relative permittivity e r54 which cannot be used for the miniaturization of microwave devices. By incorporating ldpe into the composites via a coating route high ceramic powder volume content up to 50 vol could be achieved. The produced materials are fabricated by combining ceramic powders with polymers to generate a high contrast. Polymer ceramic composites for microwave applications.

Unique polymer ceramic composites for microwave antenna applications were prepared via melt extrusion using high density polyethylene hdpe as the matrix and low density polyethylene ldpe coated bao nd 2 o 3 tio 2 bnt ceramic powders as the filler. Ceramic fibers in cmcs can have a polycrystalline structure as in conventional ceramics. Fabrication and performance assessment january 2007 ieee transactions on microwave theory and techniques 54 12 4202 4208. Fabrication and performance assessment abstract.

The coefficient of thermal expansion cte of polymer ceramic composites is an important parameter that is used in packaging technology. Microwave packaging technology demands substrate materials with high frequency compatibility minimal dielectric losses low coefficient of thermal expansion and high thermal conductivity. They can also be amorphous or have inhomogeneous chemical composition which develops upon pyrolysis of organic precursors the high process temperatures required for making cmcs preclude the use of organic metallic or glass fibers only fibers stable at temperatures above 1 000 c 1 800 f can be used. All the works mostly.